| TYPE | DESCRIPTION |
| Mount | Socket |
| Package / Case | 200-SODIMM |
| Number of Pins | 200 |
| Packaging | Bulk |
| Published | 2004 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 200 |
| Terminal Finish | MATTE TIN |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Subcategory | DRAMs |
| Technology | CMOS |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 0.6mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Operating Supply Voltage | 1.8V |
| Number of Elements | 16 |
| Temperature Grade | COMMERCIAL |
| Max Supply Voltage | 1.9V |
| Min Supply Voltage | 1.7V |
| Memory Size | 2GB |
| Speed | 667MT/s |
| Memory Type | DDR2 SDRAM |
| Clock Frequency | 333MHz |
| Supply Current-Max | 2.336mA |
| Data Bus Width | 64b |
| Organization | 256MX64 |
| Output Characteristics | 3-STATE |
| Memory Width | 64 |
| Standby Current-Max | 0.112A |
| Memory Density | 17179869184 bit |
| Max Frequency | 667MHz |
| I/O Type | COMMON |
| Refresh Cycles | 8192 |
| Height | 30mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
