72T1855L5BB

72T1855L5BB
FIFOs Memory
Integrated Device Technology (IDT)
144 Termination
-
BGA
YES
72T1855L5BB
72T1855L5BB
FIFOs Memory
Integrated Device Technology (IDT)
144 Termination
-
BGA
YES
TYPEDESCRIPTION
Factory Lead Time 7 Weeks
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case BGA
Number of Pins 144
Packaging Bulk
Published 2009
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 20
Pin Count 144
Qualification Status Not Qualified
Operating Supply Voltage 2.5V
Temperature Grade COMMERCIAL
Max Supply Voltage 2.625V
Min Supply Voltage 2.375V
Element Configuration Dual
Nominal Supply Current 60mA
Max Supply Current 60mA
Clock Frequency 83MHz
Frequency (Max) 200MHz
Access Time 3.6 ns
Organization 4KX18
Density 72 kb
Standby Current-Max 0.05A
Parallel/Serial PARALLEL
Sync/Async Asynchronous
Memory IC Type OTHER FIFO
Bus Directional Unidirectional
Retransmit Capability Yes
Output Enable YES
Cycle Time 5 ns
Length 13mm
Height Seated (Max) 1.97mm
Width 13mm
Thickness 1.76mm
RoHS Status RoHS Compliant
Lead Free Contains Lead
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