TYPE | DESCRIPTION |
ECCN (US) | EAR99 |
HTS | 8542.32.00.32 |
Module | DRAM Module |
Module Density | 1Gbyte |
Number of Chip per Module | 8 |
Chip Density (bit) | 1G |
Data Bus Width (bit) | 64 |
Maximum Clock Rate (MHz) | 667 |
Chip Configuration | 128Mx8 |
Chip Package Type | FBGA |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Maximum Operating Supply Voltage (V) | 1.9 |
Module Sides | Single |
ECC Support | No |
CAS Latency | 5 |
SPD EEPROM Support | No |
Standard Package Name | DIM |
Supplier Package | DIMM |
Mounting | Socket |
Package Height | 18.3 |
Package Length | 133.35 |
PCB changed | 240 |
Lead Shape | No Lead |
Part Status | Obsolete |
Pin Count | 240 |
Organization | 128Mx64 |
PLL | No |
Self Refresh | No |
Module Type | 240DIMM |
RoHS Status | Yes with exemptions |